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Project # 19
A computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing with Package Power Supply
| Team Lead: | Unique Rahangdale |
| Other Team Members: | Sonkolon Barua | Dikshya Bhattari |
| Faculty Advisor(s): | Dr. Dereje Agonafer |
| Department: | MAE |
| Project Type: | Graduate Student |
| Title: | A computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing with Package Power Supply |
| Abstract: | This study investigates the reliability of electronic devices under drop impact, a common failure mode in everyday use, especially for smaller devices like cell phones and laptops. Recognizing that drop impact often occurs in conjunction with other environmental factors like temperature, this research adopts a multi-dimensional approach. Specifically, the study focuses on the drop and shock performance of Quad Flat No-lead (QFN) packages mounted on boards of two different thicknesses. To simulate realistic conditions, the computational analysis couples drop testing with thermal loading by powering the package die, creating a non-uniform temperature distribution during impact. Experimental work includes characterizing the temperature-dependent material properties of the two boards, such as CTE (Coefficient of Thermal Expansion), Poisson's ratio and Young's modulus, using TMA (Thermal Mechanical Analyzer), DMA (Dynamic Mechanical Analyzer), and a universal testing machine. Finite element analysis is then employed to simulate drop tests according to JEDEC standards. The primary objective is to understand how the reliability of the assembly changes with varying board stiffness, layer stack-up and temperature, under powered conditions. By analyzing stress and strain generation in the solder interconnects during the drop test, this research provides valuable insights into the factors influencing electronic device reliability under realistic operating conditions. |
| Poster: | View Poster #19 (PDF) |
| Judges Scoring: | Submit Evaluation (judges only) |