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Project # 21
Power cycling thermal fatigue impact on solder joint reliability of the package
| Team Lead: | Unique Rahangdale |
| Other Team Members: | Megha Tangri |
| Faculty Advisor(s): | Dr. Dereje Agonafer |
| Department: | MAE |
| Project Type: | Graduate Student |
| Title: | Power cycling thermal fatigue impact on solder joint reliability of the package |
| Abstract: | In electronic packaging, understanding why devices fail is crucial for reliability. Repeatedly switching electronics on and off, known as power cycling, induces stress, particularly due to the chip's heat generation, causing uneven temperatures. To predict how long solder connections in Wafer Level Chip Scale Packages (WLCSPs) will last, computer simulations, like Finite Element Analysis, are used. WLCSPs, a direct extension of wafer fabrication, feature solder balls directly on the chip. This research investigates solder ball reliability by simulating power cycling and calculating the resulting stress and potential failures. A key factor is the difference in thermal expansion between the WLCSP components, exacerbated by the non-uniform temperature, leading to package deformation. The study specifically examines how varying the circuit board thickness impacts the overall reliability of these solder connections. |
| Poster: | View Poster #21 (PDF) |
| Judges Scoring: | Submit Evaluation (judges only) |